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the highest thermal conductivity for all the specimens was achieved for the 2% bas sample. this is because the presence of two sizes of pores (with the larger pores having a proportionately lower heat conduction coefficient) would have helped in the heat flow conduction through the soil. however, this is not entirely true because there are over one million pores that exist in each of the specimens [ 22 ]. in the thermal conduction test, the presence of biochar in the soil matrix may have also positively influenced the thermal conductivity of the soil matrix as well [ 24 ]. since the thermal conductivity of the soil/bas (2%) specimen is considerably higher than that of the soil/bas (4%) and soil (ns), this shows that increasing the biochar content from 1 to 2% in the soil matrix would lead to increased thermal conductivity of the soil matrix.

all the specimens experienced strong shrinkage during the subsequent thermal shrinking cycles. however, the 2% bas specimen did not crack in any of the first three drying/thermal cycles. the reason for this observation could be due to the restrained moisture loss because of the presence of air-filled pores within the soil matrix [ 15 ]. this was supported by the fact that the 2% bas had the highest vhc of the soil/bas specimens in the test. the susceptibility of the soil/bas to cracks during shrinkage could have been attributed to the formation of cracks in the pore structure of soil during the drying process.

the purpose of a re-flow process is to consolidate the solder to the pad, rather than simply to provide wetting. when solder is re-melted over the surface of the electronic component, it will wick down into the holes and vias of the component. once it reaches the bottom of the via, or plated through hole, it will start to flatten and may wick along the underside of the component, again following the inner lead material. the goal of a reflow process is to completely fill the spaces between all of the traces and the pads. therefore, it is better to re-flow solder for all of the connection points at one time, rather than to provide reflow for each solder connection individually. however, it is important to perform a one-shot reflow for each electronic package to ensure that all of the heat has been removed from the components and that they have had enough time to cool. 84d34552a1